Solutions
Bi’s SiP solutions enable a wide range of smart applications including smart living, smart bike, smart city and smart automotive. Advanced SMT, encapsulation, shielding as well as interconnection assembly technologies are developed to meet future requirement arised from 5G communication, AR/VR sensing, and health caring applications.
Company
Bi Components strives to be a world leading semiconductor solutions provider, offers complete turnkey solutions of system-in-package (SiP) and multi-chip module (MCM), including a full range of design, manufacturing, packaging and testing services, fulfill customers’ specification for high-performance applications.
What is System-in-Package (SiP)?
SiP is a package or module that contains a functional electronic system or subsystem that is integrated and miniaturized through IC assembly technologies. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips (such as a specialized processor, DRAM, flash memory), surface mount device (SMD) resistor/capacitor/inductor, filters, connectors, MEMS device, sensors, other active/passive components and pre-assembled package or subsystem.
