What is System-in-Package (SiP)?

SiP is a package or module that contains a functional electronic system or subsystem that is integrated and miniaturized through IC assembly technologies. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips (such as a specialized processor, DRAM, flash memory), surface mount device (SMD) resistor/capacitor/inductor, filters, connectors, MEMS device, sensors, other active/passive components and pre-assembled package or subsystem.

What We Do?

Headquartered in Singapore. Bi Components strives to be a world leading semiconductor solutions provider, offers complete turnkey solutions of system-in-package (SiP) and multi-chip module (MCM), including a full range of design, manufacturing, packaging and testing services, fulfill customers’ specification for high-performance applications.

What makes Bi products different?  SiPs were only designed by the largest companies to solve very specific problems.  This approach to SiPs has made them very costly to develop. Bi set out with the goal to be able to provide this powerful technology to all customers, not just reserved for the largest. Contact us today to learn more about our capabilities and comprehensive services!