Our SiP module leverage upon established IC assembly capabilities including copper wiring, flip chip packaging, wafer level packaging, fan-out wafer level packaging, 2.5D/3D IC and embedded chip packaging to address ongoing trends in mobile, IoT (Internet of Things), high performance computing, automotive, and artificial intelligence.
Wireless SiP Module
Application:
- · Remote Control
- · Health, Fitness and Medical Devices
- · Home Automation, Energy
Features:
- · 2.4 GHz BLE transceiver
- · ARM®sup> Cortex – M0 32 bit processor
- · 256 kb embedded flash program memory
- · 16 kb RAM
- · Dimension: 6.5x6.5x1.2mm
- · Package: AoP, LGA
Computing Storage SiP Module
Application:
- · Notebook
- · Tablet
Features:
- · Dimension: 22x42x1.8mm
- · Structure: Double sided structure in single sided NGFF card thickness
- · Protection: Molding
- · Capacity: NAND flash, 120GB/240 GB
Power SiP Module
Application:
All integrated power devices and driver can be packaged in the sample package, intelligent power switches which combined function of driver, power switch, protection circuitry and diagnostic feedback on a single IC, or power analog application are suitable to the kinds embedded technology.
Features:
- · Metal lead frame
- · Multi-die embedded in substrate
- · Double side RDL layers build up capability
- · Small form package factor capability
- · SMT on surface of substrate
- · Meets JEDEC MSL3 CLR requirements
Sensor & Optical SiP Module
Application:
- · Notebook
- · Physiological Signal Sensing
Features:
- · Structure: Optical molding + EDS
- · LED x 3pcs + photo-die x 1pcs W/B
- · EDF: 2L embedded-die substrate
- · Dimension: LGA 5.5x4.2mm²
- · Protection: Molding with clean CPD
